产品简介
东莞市新友维代理东洋UDT-1325D，硅片切割uv膜，陶瓷切割
东莞市新友维代理东洋UDT-1325D，硅片切割uv膜，陶瓷切割
产品价格：￥电询
上架日期：2013-06-01 11:26:59
产地：新友维
发货地：15377723326
供应数量：不限
最少起订：1卷
浏览量：639
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详细说明

    晶圆切割胶带 - Pressure Sensitive Series -

    晶圆切割胶带
    Part Number :
    F - 90
    T - 80
    T - 120
    GE - 200

    A dicing tape is used for fixing workpiece during the dicing process in semiconductor, optical and electrical devices manufacturing. 

    High technology is required to a dicing tape with the developments of diversified chips with high quality, in accordance with requirements of each type of workpiece.  Elegrip dicing tapes produced by DENKA can correspond with anti-static requirement.  Elegrip dicing tapes are supplied to you not only in roll but also in roll with pre-cut, sheet and other b. 

    We Toyo Adtec consider needs of each user and choose appropriate tapes.

    Feature

    ● Various product line
    ● standard type (AD series)
    ● high-perbance to difficult-to-adhere workpiece (ＧＤ series)
    ● excellent stability against elapsed deterioration (Ｔ series)
    ● high-perbance to laser-dicing (F-90)
    ● Easy pick-up with excellent expandability

    Specification
    Recommended Works Part Number Base
    Film     		Color Thickness (μm) Adhesion Thickness (μm) Adhesive Strength (N/20mm) Probe Tack (N/20mm2) Feature
    Si
    GaAs
    Other Semiconductor     		F-90MW PO MW 90 10 1 1 PVC-free type
    T-80MW PVC 80 0.8 0.7 Excellent temporal stability
    T-80HW 1.7 1
    T-120HW 120 1.7 1
    Thick Workpiece 20GE-200 LB 200 2.7 2.9 For thick workpiece

    ＊The above data is just for representing value, and not guaranteed value.
    ＊Static type is lined up.
    ＊Color : MW (Milky White) ,LB (Light Blue), T (Transparent)
    ＊Separator thickness is not included.

    晶圆切割胶带 - UV Series -

    晶圆切割胶带
    Part Number :
    UDV - 80J / UDV - 100J / UHP - 110B
    UHP - 0805MC / UHP - 1005M3
    UHP - 110M3 / UHP - 1025M3
    UHP - 1510M3 / UHP - 1525M3
    USP - 1515M4 / USP - 1515MG
    UDT - 1025MC / UDT - 1325D
    UDT - 1915MC

    A dicing tape is used for fixing workpiece during the dicing process in semiconductor, optical and electrical devices manufacturing. 

    High technology is required to a dicing tape with the developments of diversified chips with high quality, in accordance with requirements of each type of workpiece.  Elegrip dicing tapes produced by DENKA are widely used for dicing and singulation of driver ICs, LTCC substrates, EMC package substrates, Si wafers, ceramics, glass, lenses and so on. 

    Especially UV series of Elegrip dicing tapes enable strong holding power and easy peeling without glue residue, by deactivating adhesion with UV irradiation.  Elegrip dicing tapes can correspond with anti-static requirement.  Elegrip dicing tapes are supplied to you not only in roll but also in roll with pre-cut, sheet and other b. 

    We Toyo Adtec consider needs of each user and choose appropriate tapes.


    Feature

    ● Excellent control to back-side chipping and chip fly-off.
    ● Excellent adhesiveness.
    ● Smooth peeling by UV.
    ● High perbance to EMC (Epoxy Mold Compound) and other types of difficult-to-adhere workpiece.

    Recommended
    Work I     		Si
    GaAs
    Other Semi conductor
    Part Number

    UDV-
    80J

    UDV-
    100J

    UHP-
    110B

    UHP-
    0805MC

    UHP-
    1005M3

    UHP-
    110M3

    基材 PVC PO
    颜色 T MW
    总厚度 (μm)

    80

    100

    110

    85

    105

    110

    黏着力 (μm) 10 5 10
    Adhesive Strength (N/20mm)

    3.8(0.2)

    3.8(0.2)

    2.9(0.2)

    5.0(0.2)

    5.0(0.2)

    7.6(0.2)

    Probe Tack (N/20mm2)

    2.1(0.05)

    2.1(0.05)

    2.7(0.05)

    1.7(0.05)

    2.7(0.05)

    3.9(0.05)

    特性 Easy pickup For less chipping For small size chips
    Recommended
    Work II     		Package
    Part Number

    UHP-1025M3

    UHP-1510M3

    UHP-1525M3

    USP-1515M4

    USP-1515MG

    基材 PO
    颜色 MW
    总厚度 (μm)

    125

    160

    175

    165

    黏着力 (μm)

    25

    10

    25

    		15
    Adhesive Strength (N/20mm)

    12.0(0.2)

    6.5(0.2)

    13.5(0.2)

    14.5(0.2)

    15.0(0.2)

    Probe Tack (N/20mm2)

    5.5(0.05)

    4.2(0.05)

    5.6(0.05)

    6.2(0.05)

    5.9(0.05)

    特性 For encapsulated workpiece
    For less backside burrs
    For less glue scratch-up on the chip side walls
    For less against residue onto a making area
    Recommended
    Work III     		Glass
    Crystal
    Part Number

    UDT-1025MC

    UDT-1325D

    UDT-1915MC

    基材 PET
    颜色 T
    总厚度 (μm)

    125

    155

    203

    黏着力 (μm) 25 15
    Adhesive Strength (N/20mm)

    30.0(0.2)

    20.4(0.2)

    20.3(0.2)

    Probe Tack (N/20mm2)

    7.5(0.05)

    6.7(0.05)

    5.9(0.05)

    特性
    • For less backside cracking
    • For encapsulated workpiece
    • For less backside cracking

    ＊( ) is adhesive strength after UV.
    ＊The above data is just for representing value, and not guaranteed value.
    ＊Static type is lined up.
    ＊Color : MW (Milky White), T (Transparent)
    ＊UV irradiate condition : Light volume=above 150mJ/cm2.
    ＊UV irradiate condition may change with dicing products.
    ＊Separator thickness is not included.
     
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